Review Papers - SHIBUTANI Tadahiro
about 13-
ISO/TC96 SC8 ジブクレーン議長就任にあたって
澁谷忠弘
クレーン 60 ( 3 ) 1 - 1 2022.3
Authorship：Lead author Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (other) Publisher：日本クレーン協会 Single Work
-
Reliability of Power Modules
Shibutani Tadahiro
25 ( 1 ) 141 - 144 2022.1 [Reviewed] [Invited]
Authorship：Lead author, Corresponding author Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (scientific journal) Single Work
-
先端科学技術の社会総合リスクアセスメントガイドライン
澁谷忠弘,稗貫峻一,野口和彦,中山穣,笠井尚哉,三宅淳巳
高圧ガス 58 ( 616 ) 18 - 26 2021.7 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (other) Publisher：高圧ガス保安協会 Joint Work
-
Guideline for highly accelerated limit test as qualitative accelerated test procedure
Tadahiro SHIBUTANI
58 4 - 6 2021.1
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (other) Single Work
-
A fusion prognostics-based qualification test methodology for microelectronic products
Michael Pecht, Tadahiro Shibutani, Myeongsu Kang, Melinda Hodkiewicz, Edward Cripps
Microelectronics Reliability 63 320 - 324 2016.7 [Reviewed] [Invited]
Language：English Publishing type：Article, review, commentary, editorial, etc. (scientific journal) Publisher：Elsevier Joint Work
-
Standards for Tin Whisker Test Methods on Lead-Free Components
IEEE Transactions on Components and Packaging Technologies 32 ( 1 ) 216 - 219 2009.3
Language：English Publishing type：Article, review, commentary, editorial, etc. (other) Joint Work
-
Tin Copper Alloy Double-layered Plating Mitigating Tin Whiskers
Function & Materials 28 ( 9 ) 20 - 25 2008.9
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (other) Joint Work
-
Mechanism of pressure induced tin whisker formation
28 ( 8 ) 30 - 35 2008.8
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (other) Single Work
-
Evaluation of Interfacial Damage Process between Multi-layered Thin Films Using a Nanoscratch Test
9 ( 6 ) 455 - 458 2006.9
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (scientific journal) Single Work
-
Active CAE on the Basis of Statistical Design Support System
60 ( 6 ) 45 - 49 2006.6
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (scientific journal) Joint Work
-
Evaluation of Crack Initiation at Interfacial Edge on the Basis of Fracture Mechanics Concept and Application to Electronics Devices
Journal of Japan Institute of Electronics Packaging 7 ( 7 ) 639 - 644 2004.11
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (scientific journal) Single Work
-
高密度貫通配線を有するシリコン基板
フジクラ技報 105 37 - 40 2004.1
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (other) Joint Work
-
High-density Through-hole Interconnections in a Silicon Substrate
Fujikura Technical Review 33 53 - 56 2004
Language：English Publishing type：Article, review, commentary, editorial, etc. (other) Joint Work