Papers - YU Qiang
about 256-
Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
Anzawa, T., Yu, Q., Yamagiwa, M., Shibutani, T., Shiratori, M.
J. Electron. Package 132 ( 3 ) 1 - 6 2010 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints
Tadahiro Shibutani, Do-Seop Kim, Yusuke Kobayashi, Jidong Yang, Masaki Shiratori
Elsevier Journal 48 431 - 437 2008.3 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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鉛フリーはんだ接合部の応力・非線形ひずみ振幅評価に及ぼす硬化則の影響
金道燮，澁谷忠弘，白鳥正樹
エレクトロニクス実装学会誌 7 ( 2 ) 161 - 169 2004 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Shimamura, N; Yu, Q
PROCEEDINGS OF ASME 2024 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2024 2024
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Abbas, SM; Yu, Q
PROCEEDINGS OF ASME 2024 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2024 2024
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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EVALUATION OF WARPAGE DEFORMATION IN SEMICONDUCTOR DEVICE PACKAGING PROCESS
Yagi, T; Yu, Q; Shimada, H; Yanaka, Y; Masuko, T
PROCEEDINGS OF ASME 2024 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2024 2024
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Abbas, SM; Yu, Q
2024 IEEE 26TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, EPTC 103 - 108 2024
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow
Abbas, SM; Yu, Q; Pecht, M
IEEE ACCESS 11 142487 - 142494 2023.12
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Failure Mode Evaluation of QFP Package Interconnect Structure under Random Vibrations
Shimamura, N; Yu, Q
PROCEEDINGS OF THE 25TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, EPTC 2023 333 - 339 2023
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Yu Qiang, Yoshikawa Ryotaro
Journal of The Japan Institute of Electronics Packaging 25 ( 5 ) 506 - 510 2022.8
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：The Japan Institute of Electronics Packaging Joint Work
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Effect of Changes in Creep Properties Due to Sintering on Fatigue Life of Ag Sinter Bonding Layer of Power Module
Iori Yaguchi, Sho Teradaira, Leo Umino, Qiang Yu
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 1128 - 1133 2020.9 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Evaluation of Switching Loss and Imbalance in Multi-Element Power Modules
Ryotaro Yoshikawa, Tomohiro Shibuya, Sho Teradaira, Qiang Yu
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 1356 - 1363 2020.9 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Comparison and Verification of Acceleration Factor of Temperature Cycle Test by Empirical Formula and CAE Analysis
Shohei Ohashi, Taiki Ogawa, Qiang Yu
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 1289 - 1295 2020.9 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Ohashi Shohei, Ogawa Taiki, Yu Qiang
PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020) 1289 - 1295 2020
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Evaluation of Switching Loss and Imbalance in Multi-Element Power Modules
Yoshikawa Ryotaro, Shibuya Tomohiro, Teradaira Sho, Yu Qiang
PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020) 1356 - 1363 2020
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Yaguchi Iori, Teradaira Sho, Umino Leo, Yu Qiang
PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020) 1128 - 1133 2020
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Benchmark Study on Cooling and Reliability Performance Due to Difference in Structure of Power Modules
Yuta Ito, Koichi Ishiyama, Qiang Yu
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2019.7
Language：English Publishing type：Research paper (other science council materials etc.) Publisher：IEEE Joint Work
INSPEC Accession Number: 18899306
Las Vegas, NV, USA, USA -
Evaluation of Fatigue Life Considering Fillet Shape and Microstructure Nonuniformity of Solder Joint in Chip Resistor
Y. Ohno, Q. Yu
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) 57 - 61 2019 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Publisher：2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Joint Work
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Evaluation of variation of BGA solder joints fatigue life using finite element method
T. Ogawa, Q. Yu
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) 396 - 401 2019 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Publisher：2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Joint Work
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Evaluation of variation of BGA solder joints fatigue life using finite element method
Ogawa Taiki, Yu Qiang
2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 396 - 401 2019
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Evaluation of Fatigue Life Considering Fillet Shape and Microstructure Nonuniformity of Solder Joint in Chip Resistor
Ohno Yuki, Yu Qiang
2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 57 - 61 2019
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Strength Analysis of Resin Delamination of Packaging Structure of Power Module
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2018 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings)
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Reliability Evaluation of BGA Solder Joints in Vision Processor by Passive Cooling
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2018 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings)
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Thermal Performance Evaluation and Reliability Analysis of Air-cooled Power Modules
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2018 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings)
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Development of the high efficiency cooling structure of the liquid immersion cooling SR motor Sign In or Purchase
Daiki Wakabayashi, Qiang Yu, Yoshmobu Nakamura
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) 2017.12
Language：English Publishing type：Research paper (international conference proceedings) Publisher：IEEE Joint Work
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The life cycle impact assessment that the variabilities of BGA solder connection makes
Yano Ryosuke, Qiang Yu
Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th 2017.12
Language：English Publishing type：Research paper (international conference proceedings) Publisher：IEEE Joint Work
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Improvement of lifetimetime prediction of silver sintered material in automotive power devices
Ryosuke Yaejima, Shota Okuno, Qiang Yu
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) 2017.12
Language：English Publishing type：Research paper (international conference proceedings) Publisher：IEEE Joint Work
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The life cycle impact assessment that the variabilities of BGA solder connection makes
Yano Ryosuke, Yu Qiang
2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 2017
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Improvement of Lifetimetime Prediction of Silver Sintered Material in Automotive Power Devices
Yaejima Ryosuke, Okuno Shota, Yu Qiang, Nakata Yusuke, Sugawara Hiroyuki
2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 2017
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Development of the high efficiency cooling structure of the liquid immersion cooling SR motor
Wakabayashi Daiki, Yu Qiang, Nakamura Yoshinobu
2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 2017
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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A method to investigate strain rate effects on necking and fracture behaviors of advanced high-strength steels using digital imaging strain analysis
Kentaro Sato, Qiang Yu, Jiro Hiramoto, Toshiaki Urabe, Akihide Yoshitake
International Journal of Impact Engineering 75 11‐26 2015.1 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Publisher：Elsevier Joint Work
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PWBにおけるIVHの熱疲労寿命に及ぼすFR-4の積層銅像の不均質性の影響（第2報,変動要因の組み合わせの影響メカニズムとその設計への適用）
竹中国浩,于強
エレクトロニクス実装学会誌 Vol. 16 ( NO.4 ) 284 - 292 2013.7 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：エレクトロニクス実装学会 Joint Work
電子機器の実装基板信頼性に与える補強繊維の不均質性の変動要因影響と要因同士の交互作用を評価する手法を提案し、信頼性設計への適用技術を確立した。
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PWBにおけるIVHの熱疲労寿命に及ぼすFR-4の積層銅像の不均質性の影響（第1報,冷熱サイクル試験と有限要素法解析を用いた寿命の変動要因の検討）
竹中国浩,于強
エレクトロニクス実装学会誌 Vol. 16 ( NO.2 ) 106 - 118 2013.3 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：エレクトロニクス実装学会 Joint Work
電子機器の実装基板信頼性に対する補強繊維の不均質性の影響を評価する手法を提案し、交互作用の強い信頼性手法を確立した。
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Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints
Takahiro Akutsu, Qiang Yu
Proc. of InterPACK2011 2011.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis
Tomohiro Takahashi, Qiang Yu, Masahiro Kobayashi
Proc. of InterPACK2011 2011.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue Life of Solder Joint in Power-Devices
Shiqiang Zhao, Qiang Yu, Akaeda Hiroki
Proc. of InterPACK2011 2011.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions
Liu Shilin, Qiang Yu, Michael Pecht
Proc. of InterPACK2011 2011.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Study on Reliability of High-Temperature Joint in Packaging Structure
Takayuki Ishikawa, Qiang Yu, Toshikazu Oshidari, Hiromi Sugihara
2011.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin
5. Sato Hiroyuki, Qiang Yu, Sone Ryuusuke
2011.7 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties
Yuji Nishimura, Qiang Yu
Proceeding of Itherm2012 2011.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Reliability Evaluation of High-temperature Joint in Sic Power Device
11. Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, Masato Fujita, Qiang Yu
ICEP 2010 Proceedings 2010.10 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A study on reliability of NI plating in a high temperature power device
Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, Qiang Yu
Proc. of ITherm2010 2010.6 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Optimization of Design Support Method for Occupants Restraint System by Considering Interaction between Design Factors
Yuki Umezawa, Qiang Yu
Proceeding of ECCM 2010 2010.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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PWB Micro-Structural Influences over Drop Reliability in Mobile Devices
Katahira, T., Fujita, M., Yu, Q.
Journal of Solid Mechanics and Materials Engineering 4 ( 1 ) 1 - 15 2010 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
Anzawa, T., Yu, Q., Yamagiwa, M., Shibutani, T., Shiratori, M.
J. Electron. Package 132 ( 2 ) 031012 2009.9 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Publisher：ASME Joint Work
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チップ部品におけるはんだ接合部の信頼性設計手法に関する研究 ～はんだ接合寿命に及ぼす実装プロセスのばらつきの影響～
高木寛二, 于強, 澁谷忠弘, 宮内裕樹, 野呂幸弘
エレクトロニクス実装学会誌 12 ( 7 ) 643 - 650 2009 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
実装プロセスにおいてチップ部品の溶融解析を行い、はんだ接合部形状のばらつきなどの発生メカニズムを明らかにした
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チップ部品におけるはんだ接合部の信頼性設計手法に関する研究 ～き裂進展モードの解明とはんだ接合部の設計方法～
高木寛二, 于強, 澁谷忠弘, 宮内裕樹, 野呂幸弘
エレクトロニクス実装学会誌 12 ( 7 ) 636 - 642 2009 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
車載用電気抵抗などの部品のはんだ接合部に生じる熱疲労き裂の進展評価の結果に基づいて、高信頼性設計手法を提案した
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パワーモジュールのはんだ接合部における信頼性解析
安澤貴志、山際正憲、澁谷忠弘、于強、篠原主勲
日本機械学会論文集Ａ編 75 ( 758 ) 1340 - 1346 2009 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
電気-熱-構造解析手法を提案し、パワーモジュールのパワーオン・オフ信頼性試験におけるはんだ接合部の寿命評価方法を確立した
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樹脂―シリコンの微細不完全接合層を考慮したはく離強度評価
松本翼, 松崎富夫, 澁谷忠弘、于強
日本機械学会論文集Ａ編 75 ( 755 ) 839 - 844 2009 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
電子部品の樹脂封止構造の剥離強度の定量評価手法を確立するために、樹脂とSiチップの界面の不完成性が剥離強度に与える影響のメカニズムを解明し、新たな力学モデルに基づいた手法を開発した
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チップ部品の鉛フリーはんだ接合部における疲労寿命のばらつき
宮内裕樹,于強、澁谷忠弘
日本機械学会論文集Ａ編 75 ( 755 ) 815 - 822 2009 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
車載用電子部品のはんだ接合部の実装信頼性および熱疲労寿命の実用的な高精度の定量的な評価手法とばらつきの評価手法を開発した。
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はんだバンプ接続の熱衝撃試験寿命ワイブル分布傾きと破壊モードの関係
松崎富夫、于強、澁谷忠弘、松本翼
エレクトロニクス実装学会誌 12 ( 4 ) 320 - 332 2009 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
高密度実装電子部品のはんだ接合部の信頼性評価の高度化を実現するために、熱疲労寿命のばらつきの実用的かつ効率的な評価手法を開発した。また、この手法の実用性も実製品を用いて検証した。
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高純度アルミニウムを利用した高耐熱パワーデバイス実装構造における信頼性評価
山際正憲、于強、藤田雅人、篠原正典、村上善則
エレクトロニクス実装学会誌 12 ( 3 ) 238 - 247 2009 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
次世代の車載用耐高温パワーデバイスの実装構造の信頼性を確立するために、基礎となる純アルミ基板の熱疲労信頼性の実用的な評価手法を確立し、実構造での検証を行った。
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Raiability Assessmento foro Micro Solder Joints
8 ( 76 ) 566 - 572 2007.12
Language：Japanese Publishing type：Research paper (scientific journal) Single Work
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Mechanism of Damage Process on Si3N4/Cu Interface in Nanoscratch Test
Journal of Solid Mechanics and Materials Engineering Vol.1 ( No.3 ) 322 - 331 2007 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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応力緩和法を用いたはんだの弾塑性・クリープ・粘塑性の物性値取得の効率化
谷村利伸，澁谷忠弘，陳在哲，白鳥正樹
エレクトロニクス実装学会誌 10 ( 1 ) 52 - 61 2007 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls
Journal of Electronic Packaging 129 ( 1 ) 71 - 75 2007 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Study of the electrical contact resistance of multi-contact MEMS relays fabricated using the MetalMUMPs process
Journal of Micromechanics and Microengineering 16 2007
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Stress-Induced Tin Whisker Initiation Under Contact Loading
IEEE Transactions on Electronics Packaging Manufacturing 29 ( 4 ) 259 - 264 2006 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Easy reliability design approach for solder joint BGA package considering correlation of each design factor
Proc. of the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(Itherm 2006) 900 - 905 2006 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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The Effect of Voids on Thermal Reliability of BGA Lead Free Solder Joint and Reliability Detecting Standard
Proc. of the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(Itherm 2006) 1024 - 1030 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Evaluation Method of Board Level Drop Reliability for Electronic Component and Parametric Analysis
Proc. of the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(Itherm 2006) 1064 - 1069 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Thermal Fatigue Reliability Evaluation for Micro-Sintered Compact Joints Made from Sub-Micron Gold Powder
Proc. of the 10th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(Itherm 2006) 1153 - 1159 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Easy Reliability Design Approach for Solder Joint BGA Package Considering Correlation of Each Design Factor
Proc. of the Joint Symposium between Sister Universities in Mechanical Engineering(JSSUME2006) 40 - 43 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Thermal Fatigue Reliability Evaluation for Micro-Sintered Compact Joints made from Sub-Micron Gold Powder
Proc. of the Joint Symposium between Sister Universities in Mechanical Engineering(JSSUME2006) 106 - 109 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Low Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronic Devices
Proc. of the New Methods of Damage and Failure Analysis of Structural Parts 103 - 110 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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The Effect of Voids on Thermal Reliability of Lead Free Solder Joint
Proc. of the New Methods of Damage and Failure Analysis of Structural Parts 175 - 183 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Reliability Evaluation Method Electronic Device BGA Package Considering the Interaction Between Design Factors
Proc. of the International Workshop on THERMal Investigation of Ics and Systems(THERMINIC 2006) 101 - 106 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Modeling with Structure of Resins in Electronic Components
Proc. of the International Workshop on THERMal Investigation of Ics and Systems(THERMINIC 2006) 107 - 111 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Easy Reliability Design Approach for Solder Joint BGA Package Considering Correlation of Each Design Factor
Proc. of the 2006 Joint Seminar between Yokohama National University and Pukyong National University on Advanced Engineering & Science 1 - 4 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Low Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronic Devices
Proc. of the 2006 Joint Seminar between Yokohama National University and Pukyong National University on Advanced Engineering & Science 1 - 7 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Extraction Method for Design Principle of Static Behavior of Vehicle Suspension System
Proc. of the 2006 ASME International Mechanical Engineering Congress and Exposition(IMECE2006) 1 - 5(IMECE2006-14164) 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Study on Whisker Outbreak on Tin Plating by Contact Force
Proc. of the 2006 ASME International Mechanical Engineering Congress and Exposition(IMECE2006) 1 - 7(IMECE2006-14221) 2006
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Tri-state multi-contact lateral MEMS relay with high mechanical reliability
Proc. of the 8th International Coference on Electronic Materials and Packaging(EMAP2006) 957 - 969 2006 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Effective Acquisitions of Plastic, Creep, Viscoplastic Parameters of Solder Using the Stress Relaxation Method
Proc. of the 8th International Coference on Electronic Materials and Packaging(EMAP2006) 658 - 666 2006 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Mechanical Response of a Low-temperature Sintered Body Consisting of Submicron Gold Particles Consisting of Submicron Gold Particles
Proc. of the Smart Materials, Nano, and Micro-Smart Systems 2006 6413-6417 1 - 10 2006 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Evaluation of Diffusion Creep in Low Melting Point Materials by Nanoindentation Creep Test
JSME International Journal, SeriesA 49 ( 3 ) 397 - 402 2006 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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サブミクロン金粒子低温焼結マイクロ接合構造の機械的疲労信頼性評価
鶴見和則，小柏俊典，宮入正幸
エレクトロニクス実装学会誌 Vol.9 ( No.6 ) 465 - 471 2006 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Bonnet design with respect to pedestrian safety
13 ( 6 ) 467 - 478 2006 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Extraction Method for Physical Principles and Application to Static Behavior of Vehicle Suspension System
Review of Automotive Engineering 26 ( 4 ) 439 - 446 2005 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Early-Stage Analysys for MEMS Structural Optimization II : Its Application to Microrelay Reliability
Proc. of the Advances in electronic packaging 2005 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'05) 1 - 6(IPACK2005-73049) 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Early-Stage Analysys for MEMS Structural Optimization I : Concept
Proc. of the Advances in electronic packaging 2005 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'05) 1 - 6(IPACK2005-73050) 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Effect of Voids on Thermal Fatigue Reliability of Lead Free Solder joint
Proc. of the Advances in electronic packaging 2005 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'05) 1 - 6(IPACK2005-73136) 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Study on the Dynamic Behavior of Repetitive Drop Test for Electronic Componet and Reliability
Proc. of the Advances in electronic packaging 2005 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'05) 1 - 6(IPACK2005-73146) 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Evaluation of Damage Process near Interfaces during Nanoscratch Test
Proc. of the Advances in electronic packaging 2005 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'05) 1 - 6(IPACK2005-73159) 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Thermal Fatigue Assessment of Lead - Free Solder Joints
Proc. of the International Workshop on THERMal Investigation of Ics and Systems(THERMINIC 2005) 204 - 211 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Single Work
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Deformation Behavior of Tubes with Rectangular Cross Section in Prepressing for Tube Hydroforming Process
Proc. of the International Conference on Tubehydroforming Processes(TUBEHYDRO2005) 29 - 33 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Evaluation of Creep Properties
Proc. of the ASME International Mechanical Engineering Congress and Exposition(IMECE2005) IMECE2005 - 80160 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Assessment of Influence and analysis of mechanism on the reliability for solder joints of electronic device
Proc. of the ASME International Mechanical Engineering Congress and Exposition(IMECE2005) IMECE2005 - 80887 2005 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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ナノスクラッチ試験によるSi3N4/Cu薄膜界面損傷機構
澁谷忠弘，白鳥正樹，赤井武志
日本機械学会論文集（A編） 71 ( 706 ) 884 - 890 2005 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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ナノインデンテーションクリープ試験による低融点材料の拡散クリープ特性評価
澁谷忠弘，白鳥正樹
日本機械学会論文集（A編） 71 ( 710 ) 1285 - 1291 2005 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Electrostatically Actuated Micromirror Array Assembled by Using Solder Flip Chip Bonding and Electro-Thermal Fuse-Away Tethers
エレクトロニクス実装学会誌 8 ( 2 ) 108 - 115 2005 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints
Key Engineering Materials 297 ( 300 ) 1822 - 1827 2005 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Fatigue reliability evaluation for Sn-Zn-Bi and Sn-Zn lead free solder joints
Materials Transactions 46 ( 11 ) 2316 - 2321 2005 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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実装信頼性評価・設計におけるシミュレーション技術とその応用
白鳥正樹
電子情報通信学会論文誌C J88-C ( 11 ) 851 - 858 2005 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Designspace Embossing Method For Basic design Plans of a Vehicle Suspension System
Proc. of the ASME International Mechanical Engineering Congress & Exposition(IMECE2004) pp.1 - 6(IMECE2004-61474) 2004.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Contribution to Car Frontal Frame Structure Design
Proc. of the Third China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems(CJK-OSM3) 239 - 244 2004.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Analysis of Solder Joint Breakdown Life in Electronic Device Mounted in Vehicle
Proc. of the ASME International Mechanical Engineering Congress & Exposition(IMECE2004) 1 - 6(IMECE2004-60694) 2004.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Guideline for the Dropping Test of the Impact Reliability Study of Solder Joints
Proc. of the ASME International Mechanical Engineering Congress & Exposition(IMECE2004) 1 - 6(IMECE2004-61096) 2004.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints
Proc. of the Asian Pacific Conference for Fracture and Strength(APCFS2004) 103 2004.10 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Sn-3.0Ag-0.5Cuはんだ接合部における相成長による熱疲労き裂発生評価
佐山利彦，山崎聡子，森孝男，高柳毅，長井喜昭
エレクトロニクス実装学会誌 7 ( 6 ) 525 - 534 2004.9 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Development of Statistical Design Support System and its Application to Some Industrial Problems
Proc. of the 6th World Congress on Computational Mechanics (WCCMVI) 120 - 131 2004.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Contribution to Car Frontal Frame Structure Design
Proc. of the Fracture Damage of Structural Parts 215 - 222 2004.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Multidisciplinary Reliability Design of Electronics Packaging based on the First Order Reliability Method and Structural Equation Modeling
Proc. of the 10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference(MA&O) 1 - 19 2004.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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多層サブミクロン薄膜における界面コーナー部はく離発生条件の破壊力学的評価
澁谷忠弘，白鳥正樹，鶴賀哲
材料別冊 53 ( 8 ) 850 - 855 2004.8 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints
Proc. of the Joint Symposium between Sister Universities in Mechanical Engineering(JSSUME2004) 123 - 126 2004.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Contribution to Car Frontal Frame Structure Design
Proc. of the Joint Symposium between Sister Universities in Mechanical Engineering(JSSUME2004) 424 - 429 2004.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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階層的クラスタリングに基づく応答曲面法
影山雄介
日本機械学会論文集（A編） 70 ( 695 ) 953 - 961 2004.7 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Large Displacement Electrostatic Micromirror Fabricated using Solder Flip Chip Bonding
Proc. of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004) 535 - 540 2004.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Evaluation of interface strength between thin films fabricated on a silicon substrate for mixed mode of fracture
Proc. of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004) 192 - 198 2004.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Effect of Void Formation on Thermal Fatigue Reliability of Lead-Free Solder Joints
Proc. of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004) 325 - 329 2004.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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The Examination of the Drop impact Test Method
Proc. of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004) 336 - 342 2004.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Study of Influence of the Design Factors on the Reliability of BGA Solder Joints
Proc. of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004) 343 - 349 2004.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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An Integrated AWG Multi / Demultiplexer with MEMS-VOA Shutters
Proc. of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004) 523 - 528 2004.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A New MEMS Optimal Design Method Using Case
Proc. of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2004) 529 - 534 2004.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Mechanism of Three-Dimensional Interface Crack Initiation at the Corner in CU Damascene Interconnects
Proc. of the 2004 The 1st International Symposium on Micro & Nano Technology(ISMNT-1) 1 - 5 2004.3 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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モード制御アプローチによる自動車補強部材の形状最適化
安達尚希，矢島秀起，白鳥正樹
自動車技術会論文集 35 ( 3 ) 193 - 198 2004 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
ハイドロフォーミング用電縫鋼管の張出し変形特性に関する研究（蓋なし円管の自由バルジ加工）
鈴木孝司，上井清史，豊田俊介，森孝男，白鳥正樹
日本機械学会論文集（A編） 70 ( 691 ) 487 - 494 2004 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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カルマンフィルタおよび多重仮説検定を用いた応答曲面近似式の高精度化手法の提案
廣畑賢治，向井稔，川村法靖，川上崇，白鳥正樹
日本機械学会論文集A編 69 ( 683 ) 1057 - 1065 2003.9 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Fatigue strength evaluation for Sn-Zn-Bi and Sn-Zn lead-free solder joints
Proc. of the Advanced Technology in Experimental Mechanics 2003(ATEM'03) 1 - 5 2003.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Reliability Study on Sn-Ag-Cu and Sn-Zn-Bi Lead-Free Solder Joints and Their Intermetallic Compounds
Proc. of the Advanced Technology in Experimental Mechanics 2003(ATEM'03) OS10W0109 2003.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Single Work
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LSI用サブミクロン薄膜のモード別界面端はく離発生条件
澁谷忠弘，鶴賀哲，白鳥正樹
日本機械学会A編 69 ( 685 ) 1368 - 1373 2003.9 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Evaluation of Interface Strength Between Thin Films Fabricated on a Silicon Substrate for an Advanced LSI on the basis of Fracture Mechanics Concept
Proc. of the Processing & Manufacturing of Advanced Materials(THERMEC'2003) ( 4 ) 1 - 5 2003.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Evaluation of Microstructural Evolution and Thermal Fatigue Crack Initiation in Sn-Ag-Cu Solder Joints
Proc. of the Advances in electronic packaging 2003 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'03) ( 35096 ) 1 - 8 2003.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
A Research of Actuators for Micromirror Control
Proc. of the Advances in electronic packaging 2003 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'03) ( 35123 ) 1 - 6 2003.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Impact Reliability Study of BGA Solder Joints and Dropping Test Method
Proc. of the Advances in electronic packaging 2003 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'03) ( 35139 ) 1 - 7 2003.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
8ch Awg Multi/Demultiplexer with MEMS Variable optical Attenuator
Proc. of the Advances in electronic packaging 2003 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'03) ( 35145 ) 1 - 6 2003.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint
Proc. of the Advances in electronic packaging 2003 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'03) ( 35250 ) 1 - 7 2003.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Influence of the Property of the Build-up Package on Warpage at Flip Chip Assembly Process
Proc. of the Advances in electronic packaging 2003 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'03) ( 35262 ) 1 - 5 2003.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Evaluation of Interface Strength Between Thin Films Fabricated on a Silicon Substrate for an Advanced LSI on the basis of Fracture Mechanics Concept
Materials Science Forum 426 ( 432 ) 3469 - 3474 2003 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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マルチレベルアプローチによる自動車の補強部材と乗員拘束系の最適設計
小泉直也，白鳥正樹
自動車技術会論文集 34 ( 3 ) 133 - 138 2003 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Sn-Zn系低温鉛フリーはんだ接合部の機械的疲労寿命評価
金道燮，陳在哲
エレクトロニクス実装学会 6 ( 5 ) 406 - 413 2003 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Structural Design Optimization for Reducing Sound Radiation from a Vibrating Plate Using a Genetic Algorithm
JSME International Journal, Series C 46 ( 3 ) 1000 - 1009 2003 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Fatigue Strength Evaluation for Sn-Zn-Bi Lead - Free Solder Joints
Proc. of the ASME International Mechanical Engineering Congress & Exposition(IMECE2002) Paper No. 39686 2002.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Optimization Design of Vehicle Structure Considering Crash Opponent
The Second China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems (CJK-OSM2) 413 - 418 2002.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Effect of Voids on Thermal Fatigue Reliability of Lead-Free Solder Joints
Proc. of the ASME International Mechanical Engineering Congress & Exposition(IMECE2002) Paper No. 33076 2002.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Interface Strength Between Sub-Micron Thin Films in Opening and Sliding Delamination Modes
Proc. of the ASME International Mechanical Engineering Congress & Exposition(IMECE2002) Paper No. 39631 2002.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Dynamic behavior of electronics package and impact reliability of BGA solder joints
Proc. of the Damage and Fracture Mechanics Ⅶ(Computer Aided Assessment and Control) 55 - 64 2002.10 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Interface Strength of Thin Flims on Substrate for an LSI on the Basis of Fracture Mechanics Concept
Proc. of the Koria - Japan Joint Symposium on Advanced Engineering & Sience(JSSUME2002) 61 - 64 2002.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Fatigue Strength Evaluation for Sn-Zn-Bi Lead-Free Solder Joints
Proc, of the Koria - Japan Joint Symposium on Advanced Engineering & Science(JSSUME2002) 57 - 60 2002.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Mode Controlling Approach on Multi Level Optimization for Crash Safety design of Vehicle
Proc. of the 2002 International Body Engineering Conference and 2002 Automative and Transportation Technology Congress(IBEC 2002) 1 - 7 2002.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Dynamic Behavior of Electronics Package and Impact Reliability of BGA Solder Joints
Proc. of the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems(Itherm 2002) 953 - 960 2002.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
ハイドロフォーム部材の圧潰特性における加工の影響（第１報 準静的3点曲げにおける検討）
小川和洋，小笠原永久，白鳥正樹，鈴木孝司，吉武明英
日本機械学会論文集A編 669 ( 68 ) 758 - 765 2002.5 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
ハイドロフォーム部材の圧潰特性における加工の影響（第２報 準静的軸圧潰における検討と衝撃吸収部材の形状最適化）
小川和洋，小笠原永久，白鳥正樹，鈴木孝司，吉武明英
日本機械学会論文集A編 68 ( No.668 ) 580 - 587 2002.4 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Evaluation of Interface Strength between Thin Films in an LSI Based on Fracture Mechanics Concept
Stress-induced Phenomena in Metallization:Sixth International Workshop on Stress-Induced Phenomena in Metallization 612 184 - 189 2002.4 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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組み立て時のばらつきを考慮した油圧サーボバルブの信頼性設計
影山雄介，白鳥正樹
日本機会学会論文集A編 68 ( 667 ) 522 - 528 2002.3 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
Estimation of Orthotropic Thermal Conductivity of Honeycomb Material
Heat Transfer-Asian Research 31 ( 8 ) 617 - 625 2002 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Risks to Equipment Manufactures from the Incremental Transition to Pb-Free Electronics in the Supplz Chain
Proc. of the Computer Aided Life Cycle Engineering (CALCE) Electronic Products and Systems Consortium Technical Review 1 - 18 2002 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
圧着工法によるフリップチップの接続マージン評価
廣畑賢治，川村法靖，向井稔，川上崇，瀬川雅雄，高橋邦明，白鳥正樹
エレクトロニクス実装学会誌 5 ( 1 ) 47 - 53 2002 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
パネル局面形状最適設計による車室内騒音低減化シミュレーション
金田章，上玉利武史，白鳥正樹，本山惠一
日本計算工学会論文集 4 ( No.20010038 ) 15 - 20 2002 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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音響出力低減を目的とした振動板の局面惠助最適設計とロバスト解の検討
金田章，上玉利武史，白鳥正樹，本山惠一
日本計算工学解論文集 4 ( No.20020008 ) 169 - 174 2002 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
Optimization Approach for Reducing Sound Power from a Vibrating Plate by Its Curvature Design
JSME International Journal, Series C 45 ( 1 ) 87 - 98 2002 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Analysis of Stress Intensity Factor due to Surface Crack Propagation in Residual Stress Fields Caused by Welding (Comparison of Influence Function Method and Inherent Strain Analysis)
JSME International Journal, Series A 45 ( 2 ) 199 - 207 2002 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
BGAはんだ接合部の形状予測と残留応力評価
酒井秀久,白鳥正樹，金子正秀，福田孝，茂木正徳
エレクトロニクス実装学会誌 4 ( 7 ) 581 - 589 2001.11 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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応答局面法およびベイズ理論に基づく構造信頼性設計手法の提案
廣畑賢治，川上崇，向井稔，川村法靖，白鳥正樹
日本機械学会論文集A編 67 ( 660 ) 1297 - 1304 2001.8 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
Process Simulation of BGA Package
Proc. of the Advances in electronic packaging 2001 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPACK'01) 1 - 8 2001.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Stochastic Structural Reliability Design for Electronics Packages Using Response Surface Methodology and Bayes' Theory
Proc. of the Advances in electronic packaging 2001 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPACK'01) 1 - 8 2001.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Reliability Etimation for BGA Solder Joints in Organic PKG
Proc. of the Advances in electronic packaging 2001 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPACK'01) 1 - 6 2001.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Effect of Interfacial Factors on Fatigue Lifetime of Lead-Free Die-Attach Solder Joint
Proc. of the Advances in electronic packaging 2001 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPACK'01) 1 - 8 2001.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
The Effect of Intermetallic Compound on Thermal Fatigue Reliability of Lead-Free Solder Joints
Proc. of the Advances in electronic packaging 2001 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPACK'01) 1 - 8 2001.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Effect of Forming on the Crashworthiness of Hydroformed Member
Proc. of the Numerical Methods in Industrial Forming Processes(NUMIFORM2001) 951 - 956 2001.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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統計的設計支援システムを用いた有限要素法によるCSPパッケージの熱疲労信頼性評価
加賀靖久，白鳥正樹，
エレクトロニクス実装学会誌 4 ( 3 ) 225 - 230 2001.5 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
Robust and optimal parameter design using SDSS and reliability design and application to hydraulic servo value
Proc. of the Computer Aided Optimum Design of Structures Ⅶ(Opti2001) 14 - 22 2001.5 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Mode controlling approach on multi mode optimization for crash safety design of vehicle
Proc. of the Computer Aided Optimum Design of Structures Ⅶ(Opti2001) 34 - 42 2001.5 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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繰返し接合負荷を受ける回転粘弾性体の数値解析
鈴木弘三，後藤仁一郎，白鳥正樹
日本機械学会論文集A編 67 ( 654 ) 225 - 230 2001.2 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
BGAパッケージはんだ接合部熱疲労信頼性簡易評価
加賀靖久，白鳥正樹，木船学
日本機械学会論文集A編 67 ( 654 ) 216 - 224 2001.2 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
Optimum Design of Vehicle Frontal Structure and Occupant Restraint System for Crashworthiness(A Multilevel Approach Using SDSS)
JSME International Journal, Series A 44 ( 4 ) 594 - 601 2001 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
The Effect of Intermetalic Compound on Thermal Fatigue Reliability of Lead-Free Solder Joints
Proc. of the Asian Pacific Conference on Fracture and Strength'01 and International Conference on Advanced Technology in Experiment Mechanics '01(APCFS & ATEM 2001) 935 - 940 2001 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
CSP Mounting Reliability with Sn-Zn-Bi in JIEP Project
Proc. of the 2nd International Symposium on Environmentall Conscious Design and Inverse Manufacturing(EcoDesign01) 2001 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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均質化法による粒子分散形複合材料の特性評価
加賀靖久，後藤仁一郎，小石正隆，白鳥正樹
日本機械学会論文集A編 66 ( 652 ) 2151 - 2156 2000.12 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
Optimization for Reducing Sound Power Radiated From a Vibrating Plate
Proc. of the Fifth International Conference on Motion and Vibration Control(MOVIC) 933 - 938 2000.12 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
統計的設計システムを用いた有限要素法によるアンダーフィル実装構造の熱疲労信頼性評価
加賀靖久，白鳥正樹
エレクトロニクス実装学会誌 3 ( 7 ) 585 - 591 2000.11 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
The Effect of Intermetallic Compound on Thermal Fatigue Reliability of Lead - Free Solder Joints
Proc. of the 2nd International Japan-Koria Symposium 213 - 219 2000.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
統計的設計支援システムによるロバスト性を考慮した最適設計
野崎敦敬，柏村孝義，白鳥正樹
日本機械学会論文集A編 66 ( 650 ) 1827 - 1833 2000.10 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
Development of Statistical Optimization Method and its Application to Crash Safety Design of Vehicles
Proc. of European Congress on Computational Methods in Applied Sciences and Engineering(ECCOMAS2000) 244 2000.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Optimum Design of Vehicle Frontal Structure and Occupant Restraint System for Crashworthiness ～A Multilevel Approach Using SDSS～
Proc. of the 8th AIAA/USAF/NASA/ISSMO Symposium on Multidisciplinary Analysis and Optimization 1 - 11 2000.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Study of Automobile Suspension Design Using Optimization Technique
Proc. of the 8th AIAA/USAF/NASA/ISSMO Symposium on Multidisciplinary Analysis and Optimization(AIAA MDO) 1 - 6 2000.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Effect of Hydro-forming Process on Impact Absorption Member
Proc. of the Joint Symposium between Sister Universities in Mechanical Engineering(JSSUME2000) 175 - 178 2000.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Development of the Database of the Stress Intensity Factors for Nozzle Corner Cracks
Proc. of the 2000 ASME Pressure Vessels and Piping Conference(PVP2000) 400 279 - 289 2000.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Shape Predition and Residual Stress Evaluation of BGA and Flip Chip Solder Joints
Proc. of the 7th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(Itherm 2000) 181 - 186 2000.5 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Influence on Injury Criteria of Occupant Restraint System
Proc. of the SAE 2000 World Congress(SAE2000) 147 - 153 2000.3 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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自動車衝突安全設計における補強部材の多目的最適化
矢島秀起，吉本毅，白鳥正樹，本山惠一
日本機械学会論文集A編 66 ( 641 ) 1 - 6 2000.1 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
ハニカム材料の直交異方性熱伝導率評価
小笠原永久，白鳥正樹，藏原鉄二
日本機械学会論文集B編 65 ( 639 ) 3729 - 3733 1999.11 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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自動車の安全装置に対する統計的設計支援システムの適用
矢島秀起，白鳥正樹，独古泰弘，伊藤重雄，本山惠一
日本機械学会論文集A編 65 ( 637 ) 1874 - 1880 1999.9 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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The Application of the Statistical Design Support System toward Optimization of Vehicle Safety Equipment
Proc. of the 7th annual International Body Engineering Conference & Exposition(IBEC'99) ( 01-329 ) 1 - 6 1999.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Multi-Objective Optimization for Crash Safety Design Design of Vehicle
Proc. of the 7th annual International Body Engineering Conference & Exposition(IBEC'99) ( 01-3210 ) 1 - 7 1999.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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影響関数法および固定ひずみ解析法による溶接残留応力場における表面き裂の応力拡大係数の評価
宮崎克雅，菅野智，望月正人，林眞琴，白鳥正樹
日本機械学会論文集(A編) 65 ( 636 ) 1709 - 1715 1999.8 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Development of a Software System Estimating Stress Intensity Factor and Fatigue Crack Propagation for Three-Demensional Surface Cracks by an Influence Function Method
Proc. of the 1999 ASME Pressure Vessels and Piping Conference(PVP'99) ( 385 ) 299 - 309 1999.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Numerical Analysis of Periodic Stress and Temperature Distribution on a Rotating Viscoelastic Disk under Contact
Proc. of the Advanced Technology in Experimental Mechanics'99(ATEM'99) 1 294 - 299 1999.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Elastic-Plastic Analysis of Honeycomb Sandwich Panel by Using Honeycomb Element
JSME International Journal Series A 42-3 381 - 387 1999.6 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Thermal Fatigue Reliability Assessment for Solder Joints of BGA Assembly
Proc. of the Advances in electronic packaging 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'99) 239 - 246 1999.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Thermal Fatigue Assessment for Solder Joints of Underfill Assembly
Proc. of the Advances in electronic packaging 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'99) 271 - 275 1999.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Evaluation for Fatigue Life of CSP Solder Joints Using Piezoelectric Translator for the Actuator and the Measurement without Dislocation
Proc. of the Advances in electronic packaging 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'99) 465 - 468 1999.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Reliability Analysis of BGA Packages-A Tool for Design Engineers
Proc. of the Advances in electronic packaging 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(Interpack'99) 1763 - 1767 1999.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Thermal Fatigue Reliability Assessment for Solder Joints of BGA Assembly
Proc. of the 3rd 1999 IEMT/IMC Symposium 170 - 175 1999.4 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Optimization of reinforced for crash safety design of vehicles
Proc. of the Computer Aided Optimum Design of Structures Ⅵ(Opti99) 355 - 363 1999.3 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Optimal and robust design of ninlinear structures under uncertain loads using statistical optimization method
Proc. of the Computer Aided Optimum Design of Structures Ⅵ(Opti99) 97 - 105 1999.3 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Application of the Statical Design Support System toward optimazation of vehicle safety equipment
Proc. of the Computer Aided Optimum Design of Structures Ⅵ(Opti99) 129 - 137 1999.3 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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AIベースBGAはんだボール接合部の疲労寿命評価
石川浩嗣，白鳥正樹
エレクトロニクス実装学会誌 2 ( 1 ) 40 - 44 1999.1 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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簡易モデルを用いたハニカムサンドウィッチ構造材料の熱変形解析
小笠原永久，白鳥正樹，藏原鉄二
日本機械学会論文集(A編) 65 ( 629 ) 127 - 132 1999.1 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
Experimental/Numerical Analyses of a Viscoelastic Body under Rolling Contact
Mechanics of Time - Dependent Materials 3 245 - 261 1999 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Elastic - Plastic Analysis of Honeycomb Sandwich Panel by Using Honeycomb Element
JSME International Journall, SeriesA 42 ( 3 ) 381 - 387 1999 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
BGAはんだ接合部の形状を考慮した疲労寿命評価
白鳥正樹
エレクトロニクス実装学会誌 1 ( 4 ) 278 - 283 1998.9 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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簡易モデルを用いたハニカムサンドウィッチ構造材料の弾塑性解析
小笠原永久，白鳥正樹,宮野篤
日本機械学会論文集(A編) 64 ( 624 ) 2059 - 2064 1998.8 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Statistical Optimization Method For Osteotomy of Knee Osteoarthritis
Proc. of the Third World Cougness of Biomechanics(WCB'98) 400 1998.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Reliability Estimation Method for BGA Joints
Proc. of the Third International Symposium on Electronic Packaging Technology(ISEPT'98) 301 - 310 1998.8
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Thermal Deformation analysis of Honeycomb Sandwich Construction
Proc. of the Joint Symposium between Sister Universities in Mechanical Engineering(JSSUME98) 1 - 4 1998.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Development of Statistical Optimization Method and its Application to Nonlinear Dynamic Structural Problem
Proc. of the Computational Mechanics - New Trends and Applications(Proceedings of WCCM IV) 1 - 12 1998.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Study of The Effects of BGA Solder Geometry on Fatigue Life and Reliability Assessment
Proc. of the 6th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic System(Itherm'98) 229 - 235 1998.5 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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電子デバイスはんだ接合部の熱疲労強度における解析・実験ハイブリッド評価(第2報:機械的疲労試験による評価)
白鳥正樹，金子誠史，石原達也，王樹波
日本機械学会論文集(A編) 64 ( 619 ) 558 - 563 1998.3 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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電子デバイスはんだ接合部の熱疲労強度における解析・実験ハイブリッド評価(第1報:熱サイクル加速試験の効率化と熱疲労強度評価)
白鳥正樹，王樹波，金子誠史，石原達也
日本機械学会論文集(A編) 64 ( 619 ) 550 - 557 1998.3 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
ハニカム構造材料の衝撃吸収特性に関する研究（第２報，衝撃圧潰応力の評価）
小笠原永久，白鳥正樹，宮原進，宮野篤
日本機械学会論文集(A編) 63-616 2575 - 2579 1997.12 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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表面実装はんだ接合部の強度信頼性評価
白鳥 正樹
回路実装学会誌 6 ( 12 ) 384 - 390 1997.9 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
-
New Study Bumping Technology Using Copper Wire
Proc. of the Surface Mount International, Advanced Electronics Manufacturing Technologies 273 - 277 1997.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Statistical optimization method
Proc. of the Computer Aided Optimum Design of Structures Ⅴ(Opti97) 214 - 227 1997.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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統計的最適化手法におけるばらつきと構造信頼性の評価
柏村孝義，白鳥正樹
日本機械学会論文集(A編) 63-610 1348 - 1353 1997.6
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Structural Optimization of Electronic Components by Using Statistical Optimization Method
Proc. of the Advances in electronic packaging 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPack'97) 19 ( 1 ) 1071 - 1077 1997.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Fatigue Crack Propagating Evaluation of Microelectronics Solder Joints
Proc. of the Advances in electronic packaging 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPack'97) 19-2 1445 - 1450 1997.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Life Assessment of Solder Joint Advances
Proc. of the Advances in electronic packaging 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPack'97) 19-2 1471 - 1477 1997.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Reliability and Structure Optimization of BGA Packages
Proc. of the Advances in electronic packaging 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference(InterPack'97) 19-2 1761 - 1765 1997.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Viscoelastic Stress Analysis of a Strip Plate under Moving Contact with Dry Friction
Proc. of the International Conference on Materials and Mechanics '97(ICM&M'97) 503 - 508 1997.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Numerical / Experimental Analyses of a Viscoelastic Body Under Rolling Contact
Proc. of the 1997 SEM Spring Conference on Experimental Mechanics 371 - 372 1997.6 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Modeling and Analyses of Honeycomb Buckling
Proc. of the Computational Engineering Science(ICES'97) 91 - 96 1997.5 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
ハニカム構造材料の衝撃吸収特性に関する研究(第1報,準静的状態における逐次座屈現象)
小笠原永久，白鳥正樹，宮原進
日本機械学会論文集(A編) 63-608 774 - 779 1997.4 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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自動車用シートの衝撃挙動に関する研究
柏村孝義，白鳥正樹
日本機械学会論文集(A編) 63-607 624 - 629 1997.3 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Akin 特異要素による異材接合端部における特異応力場の評価
王樹波，白鳥正樹
日本機械学会論文集(A編) 63 ( 606 ) 322 - 327 1997.2 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Fatigue-Strength Prediction of Microelectronics Solder Joints Under Thermal Cyclic Loading
IEEE Transactions on Components, Packaging, and Manufacturing Technology Part.A, Vol.20 ( 3 ) 266 - 273 1997 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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統計的最適化手法による衝撃荷重を受ける構造部材の最適設計
柏村孝義，森孝男，白鳥正樹，丸山修
日本機械学会論文集（A編） 62 ( 603 ) 2422 - 2427 1996.11 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Material Design and Strength Evaluation of Honeycomb Sandwich Structures
Proc. of the Japan - Korea joint symposium on advanced technology and science 169 - 174 1996.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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実験計画法,数理計画法を用いた構造最適化
柏村孝義， 白鳥正樹，国府田勲
日本機械学会論文集(A編) 62-601 ( A ) 2180 - 2185 1996.9 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Fatigue-Strength Prediction of Microelectronics Solder Joints under Thermal Cyclic Loading
Proc. of Intersociety Conference on Thermal Phenomena in Electronic Systems(I-Therm V) 151 - 157 1996.5 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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表面実装部品はんだ接合部の弾塑性-クリープ有限要素解析法に関する研究
王樹波，白鳥正樹
日本機械学会論文集(A編) 62-594 ( A ) 527 - 532 1996.2 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Modeling and Analyses of a Honeycomb Sandwich Construction
Proc. of the International Conference on Computer Engineering Science(Computational Mechanics '95) 2 2365 - 2370 1995.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Computational and Experimental Hybrid Approach to Creep-Fatigue Behavior of Surface-Mounted Solder Joints
Proc. of the International Intersociety Electronic Packaging Conference(InterPack'95) 10-1 451 - 457 1995.3 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Analysis of Stress Intensity Factors for Surface Cracks in Thermal Stress Field
Proc. of the International Intersociety Electronic Packaging Conference(InterPack'95) 305 379 - 385 1995.3 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Study of Mechanical and Thermal Stress Behavior Due to Global and Local Thermal Mismatch of Dissimilar Materials in Electronic Packaging
Proc. of the International Intersociety Electronic Packaging Conference(InterPack'95) 10-1 389 - 394 1995.3 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Fatigue-Strength Prediction of Microelectronics Solder Joints under Thermal Cyclic Loading
Proc. of the Japan - Korea joint symposium on advanced technology and science 109 - 114 1995 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Finite Element and Experimental Study to Creep-Fatigue Behavior of Microelectronics Solder Joints
Proc. of the 1995 ASME International Mechanical Engineering Congress & Exposition 9 1 - 8 1995 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Thermal Condiction and Thermal Stress Analysis of Surface-Mount Assembly with a Solder Joint Element
Proc. of the Mechanicals and Materials for Electronic Packaging:Thermal and Mechanical Behavior and Modering 2-187 205 - 211 1994.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Benchmark Test of Computational Mechanics in Electronic Devices/Components
Proc. of the Mechanicals and Materials for Electronic Packaging:Thermal and Mechanical Behavior and Modering 2-187 63 - 72 1994.11 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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A Benchmark Test of Computational Mechanics in Electronic Devices/Components
Proc. of the Computational Mechanics for Electronic Devices/Components:International Symposium on highly Advanced Computing(ISAC'94) 177 - 195 1994.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Thermal Stress Analysis of Surface - Mount Assembly by an Influence Function Method
Proc. of the Third World Congress on Computational Mehcanics(WCCMⅢ) 498 - 499 1994.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Application of Infrared Thermography to Detection of Cracks
JSME International Journal, Series A 37 ( 3 ) 296 - 302 1994 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Application of Infrared Thermography to Detection of Flaws in Honeycomb Sandwich Constructions
JSME International Journal, Series A 37 ( 4 ) 396 - 402 1994 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Analysis of Stress Intensity Factors and Probabilistic Fatigue Life Assessment for Surface Cracks in Flip Chip Solder Joints
Proc. of the 1993 ASME International Electronic Packaging Conference 4-1 487 - 492 1993.9 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Stress Analysis of Surface-Mount Assembly by an Influence Function Method
Proc. of the 1993 ASME International Electronic Packaging Conference 4-1 227 - 232 1993.9
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Detection of Cracks and Its Image Processing by Infrared Thermography
Proc. of the Asian Pacific Conference on Fracture and Strength '93(APCFS'93) 391 - 396 1993.9
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Detection of Flaws in Honeycomb Sandwich Constructions by Infrared Thermography
Proc. of the Conference on Advanced Technology in Experimental Mechanic '93(ATEM'93) 83 - 88 1993.7 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Nonsteady Thermal Stress Analysis and Thermal Fatigue Strength of Metal-CFRP Bonded Joints
JSME International Journal, Series A 36 ( 1 ) 43 - 49 1993 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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金属－CFRP接着継手の熱疲労強度評価（第２報，機械的疲労強度試験による評価）
白鳥正樹，森孝男
日本機械学会論文集（A編） 58 ( 550 ) 976 - 979 1992.6 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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金属－CFRP継ぎ手の非定常熱応力解析と熱疲労強度
白鳥正樹，森孝男
日本機械学会論文集（A編） 57 ( 541 ) 2030 - 2035 1991.9 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work
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Three-Dimensional BEM Analysis for Mixed Mode Interface Cracks Considering Crack Clusure
Proc. of the International Conference on Structural Mechanics in Reactor Technology(SMiRT 11) 11 ( G2 ) 123 - 128 1991.8 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Strength Estimation of Metal-FRP Bonded Joints and Its Application to a Filament Would Product
Proc. of the 36th International SAMPE Symposium and Exhibition 806 - 817 1991.4 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Evaluation of Strength for Metal-FRP Boded Joints
Proc. of the 4th Coference of Asian-Pacific Congress on Strength Evalution(APCS-91) Ⅰ 632 - 637 1991 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Strength of Metal-FRP Bonded Joints under Thermal Cycle
Proc. of the Mechanical behaviour of materials-VI 3 41 - 46 1991 [Reviewed]
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
-
Low Temperature Strength of Metal-FRP Bonded Joints
JSME International Journall, SeriesⅠ 34 ( 2 ) 257 - 263 1991 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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金属－ＦＲＰ接着継手の低温強度
森孝男，竹花荘治，白鳥正樹
日本機械学会論文集（A編） 56 ( 523 ) 437 - 445 1990 [Reviewed]
Language：Japanese Publishing type：Research paper (scientific journal) Joint Work