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Affiliation |
Faculty of Engineering, Division of Systems Research |
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Job Title |
Associate Professor |
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Research Fields, Keywords |
Unit processes for 3D integration, advanced packaging |
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Web Site |
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Related SDGs |
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INOUE Fumihiro
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ORCID
Degree 【 display / non-display 】
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Doctor of Engineering - Kansai University
Campus Career 【 display / non-display 】
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2021.4
Duty Yokohama National UniversityFaculty of Engineering Division of Systems Research Associate Professor
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2024.4
Concurrently Yokohama National UniversityInstitute for Multidisciplinary Sciences Associate Professor
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2022.10
Concurrently Yokohama National UniversityInstitute of Advanced Sciences Associate Professor
External Career 【 display / non-display 】
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2011.3-2014.10
imec
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2013.4-2014.10
Tohoku University Special researcher of the Japan Society for the Promotion of Science
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2014.10-2021.3
imec Researcher
Books 【 display / non-display 】
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Exploring Bond Strength for Advanced Chiplet with Hybrid Bonding
Fuse, J.; Iwata, T.; Yoshihara, Y.; Sano, M.; Inoue, F.（ Role： Joint author , vol28, (1) 39-45）
Chip Scale Review
Language：English Book type：Scholarly book
Papers 【 display / non-display 】
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Uedono, A; Hasunuma, R; Kitagawa, H; Yoshihara, Y; Inoue, F; Mihara, K; Aoki, S; Hare, T; Mori, K; … Show more authors
Uedono, A; Hasunuma, R; Kitagawa, H; Yoshihara, Y; Inoue, F; Mihara, K; Aoki, S; Hare, T; Mori, K; Murugesan, M; Fukushima, T Hide authors
ACS APPLIED ELECTRONIC MATERIALS 7 ( 23 ) 10761 - 10767 2025.12
Language：English Publishing type：Research paper (scientific journal) Joint Work
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La, MTN; Otake, Y; Goundar, JA; Inoue, F
JOURNAL OF THE ELECTROCHEMICAL SOCIETY 172 ( 12 ) 2025.12
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Disaggregation and Re-Integration: Emerging Trends in Semiconductor Integration with Chiplets
Inoue Fumihiro
Journal of The Japan Institute of Electronics Packaging 28 ( 6 ) 511 - 515 2025.9
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：The Japan Institute of Electronics Packaging Single Work
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井上 史大
SCAS news / 技術・経営戦略室 編 2025 ( 2 ) 5 - 9 2025.8
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：大阪 : 住化分析センター Single Work
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横浜国立大学・井上先生の取り組み
井上 史大, 今井 正芳
精密工学会誌 91 ( 7 ) 731 - 734 2025.7
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：公益社団法人 精密工学会 Joint Work
Review Papers 【 display / non-display 】
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Uedono, A; Hasunuma, R; Onishi, K; Kitagawa, H; Inoue, F; Michishio, K; Oshima, N
JOURNAL OF APPLIED PHYSICS 136 ( 4 ) 2024
Language：The in addition, foreign language Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
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Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyn … Show more authors
Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyne, E. Hide authors
Journal of Manufacturing Processes 58 811 - 818 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
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Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne … Show more authors
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne, E. and De. Gendt, S. Hide authors
ECS Journal of Solid State Science and Technology 9 ( 12 ) 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
Awards 【 display / non-display 】
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令和６年度科学技術分野の文部科学大臣表彰【若手科学者賞】
2024.4 文部科学省
Individual or group name of awards：井上史大
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2024.7 産経新聞社 ハイブリッド接合の開発と省電力チップレット集積技術への適用
Individual or group name of awards：井上史大
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第30回半導体・オブ・ザ・イヤー2024 半導体製造装置部門 優秀賞
2024.6 電子デバイス産業新聞（発行：株式会社産業タイムズ社） 「新たなチップ集積手法によるDie-to-Wafer ハイブリッド接合技術の開発
Individual or group name of awards：井上史大
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Best Student Award
2023.11 ICPT2023 Optimization of Pre-Bonding Surface for Cu/SiCNHybrid Bonding
Individual or group name of awards：Kohei Nakayama
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MES2022 ベストペーパー賞
2023.9 エレクトロニクス実装学会 ハイブリッド接合に向けた化学機械研磨中の金属腐食挙動の解析
Individual or group name of awards：岩田 知也、中山 航平、布施 淳也、蛯子 颯大、大西 洸輝、北川 颯人、井上 史大（横浜国立大学）
Preferred joint research theme 【 display / non-display 】
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Semiconductor manufacturing processes
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Hybrid bonding
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CMP
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Electrochemical deposition
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Direct bonding
Charge of on-campus class subject 【 display / non-display 】
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2025 Design of Processing Systems A
Graduate school of Engineering Science
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2025 Precision engineering
Graduate school of Engineering Science
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2025 Machine Design 2
College of Engineering Science
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2025 Machine Design 1
College of Engineering Science
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2025 Design of Processing Systems B
Graduate school of Engineering Science
Media Coverage 【 display / non-display 】
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チップレット集積の課題は山積み、うかうかできない日本企業
日経BP 日経XTECH 2024.2
Author：Other
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「後工程から日本の半導体を盛り返したい」…横浜国立大准教授が3D集積技術に挑む
日刊工業新聞 日刊工業新聞 ニュースイッチ 2024.2
Author：Other