|
Affiliation |
Faculty of Engineering, Division of Systems Research |
|
Job Title |
Associate Professor |
|
Research Fields, Keywords |
Unit processes for 3D integration, advanced packaging |
|
Web Site |
|
|
Related SDGs |
|
INOUE Fumihiro
|
|
|
ORCID
Degree 【 display / non-display 】
-
Doctor of Engineering - Kansai University
Campus Career 【 display / non-display 】
-
2021.4
Duty Yokohama National UniversityFaculty of Engineering Division of Systems Research Associate Professor
External Career 【 display / non-display 】
-
2011.3-2014.10
imec
-
2013.4-2014.10
Tohoku University Special researcher of the Japan Society for the Promotion of Science
-
2014.10-2021.3
imec Researcher
Papers 【 display / non-display 】
-
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Park Kimoon, Inoue Fumihiro, Derakhshandeh Jaber, Yoo Bongyoung
JAPANESE JOURNAL OF APPLIED PHYSICS 61 ( 4 ) 041003-1 - 041003-9 2022.4 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging
Inoue Fumihiro, Phommahaxay Alain, Gokita Yohei, Moeller Berthold, Beyne Eric
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 119 ( 5-6 ) 3427 - 3435 2022.3 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Inoue Fumihiro, Iacovo Serena, El-Mekki Zaid, Kim Soon-Wook, Struyf Herbert, Beyne Eric
IEEE ELECTRON DEVICE LETTERS 42 ( 12 ) 1826 - 1829 2021.12 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
-
Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Inoue Fumihiro, Iacovo Serena, El-Mekki Zaid, Kim Soon-Wook, Struyf Herbert, Beyne Eric
IEEE Electron Device Letters 42 ( 12 ) 1826 - 1829 2021.11
Language：English Publishing type：Research paper (scientific journal) Publisher：IEEE Joint Work
This letter describes the use of area-selective electroless Cu deposition for topography control of Cu-SiCN hybrid bonding pads. The electroless deposition of Cu allows one to obtain protrusions on hybrid bonding Cu pads without further polishing optimization. A recessed Cu pad after chemical mechanical polishing becomes a protrusion after electroless deposition. This indicates that the electroless Cu film was selectively deposited on Cu, without deposition on the SiCN surface. A void-free Cu-Cu bonding interface was observed after annealing at 350 °C with an electroless Cu layer at the interface. 100% electrical connection was obtained at 1.4- μm pitch where the deposition thickness was on target.
-
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Iacovo Serena, Peng Lan, Nagano Fuya, Uhrmann Thomas, Burggraf Jurgen, Fehkuhrer Andreas, Conard Th … Show more authors
Iacovo Serena, Peng Lan, Nagano Fuya, Uhrmann Thomas, Burggraf Jurgen, Fehkuhrer Andreas, Conard Thierry, Inoue Fumihiro, Kim Soon-Wook, De Vos Joeri, Phommahaxay Alain, Beyne Eric Hide authors
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) 2097 - 2104 2021.6 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
Review Papers 【 display / non-display 】
-
Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyn … Show more authors
Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyne, E. Hide authors
Journal of Manufacturing Processes 58 811 - 818 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
-
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne … Show more authors
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne, E. and De. Gendt, S. Hide authors
ECS Journal of Solid State Science and Technology 9 ( 12 ) 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
Awards 【 display / non-display 】
-
2022.3 一般財団法人 田中貴金属記念財団 貴金属配線による裏面電源供給ネットワークの形成
Individual or group name of awards：井上 史大
-
第36回「研究費の助成」
2022.3 東京応化科学技術振興財団 「形態制御めっき技術を用いた低温Cu-SiCNハイブリッド接合技術の開発」
Individual or group name of awards：井上史大
-
Outstanding Technical Paper Award
2021.5 国際会議 ICEP2021 Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
Individual or group name of awards：Fumihiro Inoue, Jaber Derakhshandeh, Carine Gerets, Eric Beyne
-
ECTC2020 Outstanding Session Paper
2020.5 IEEE 10 and 7 µm Pitch Thermo-Compression Solder Joint, Using a Novel Solder Pillar and Metal Spacer Process
Individual or group name of awards：Jaber Derakhshandek, Giovanni Capuz, Vladimir Cherman, Fuｍihiro Inoue, Inge De Preter, Lin Hou, Pieter Bex, Carine Gerets, Fabrice Duval, Thomas Webers, Julien Bertheau, Stefaan Van Huylenbroeck, Alain Phommahaxay, Ehsan Shafahian, Geert Van der Plas, Eric Beyne, Andy Miller, Gerald Beyer - IMEC
Preferred joint research theme 【 display / non-display 】
-
3D integration
-
Semiconductor manufacturing processes
-
Hybrid bonding
-
CMP
-
Electrochemical deposition
Charge of on-campus class subject 【 display / non-display 】
-
2022 Precision engineering
Graduate school of Engineering Science
-
2022 Machine Design 2
College of Engineering Science
-
2022 Machine Design 1
College of Engineering Science
-
2022 Design of Processing Systems B
Graduate school of Engineering Science
-
2022 Design of Processing Systems A
Graduate school of Engineering Science