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Affiliation |
Faculty of Engineering, Division of Systems Research |
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Job Title |
Associate Professor |
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Research Fields, Keywords |
Unit processes for 3D integration, advanced packaging |
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Web Site |
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Related SDGs |
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INOUE Fumihiro
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ORCID
Degree 【 display / non-display 】
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Doctor of Engineering - Kansai University
Campus Career 【 display / non-display 】
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2021.4
Duty Yokohama National UniversityFaculty of Engineering Division of Systems Research Associate Professor
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2024.4
Concurrently Yokohama National UniversityInstitute for Multidisciplinary Sciences Associate Professor
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2022.10
Concurrently Yokohama National UniversityInstitute of Advanced Sciences Associate Professor
External Career 【 display / non-display 】
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2011.3-2014.10
imec
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2013.4-2014.10
Tohoku University Special researcher of the Japan Society for the Promotion of Science
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2014.10-2021.3
imec Researcher
Papers 【 display / non-display 】
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Temporary Direct Bonding by Low Temperature Deposited SiO<sub>2</sub> for Chiplet Applications
Onishi, K; Kitagawa, H; Teranishi, S; Uedono, A; Inoue, F
ACS APPLIED ELECTRONIC MATERIALS 6 ( 4 ) 2449 - 2456 2024.4
Language：English Publishing type：Research paper (scientific journal) Joint Work
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近藤 悠介, 中村 雄三, 岩田 知也, 布施 淳也, 井上 史大
マイクロエレクトロニクスシンポジウム論文集 33 226 - 228 2023.9
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：東京 : エレクトロニクス実装学会 Joint Work
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佐野 麻理恵, 岩田 知也, 布施 淳也, 吉原 佑樹, 根本 俊介, 井上 史大
マイクロエレクトロニクスシンポジウム論文集 33 389 - 391 2023.9
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：東京 : エレクトロニクス実装学会 Joint Work
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ウエハ接合前後プロセスが接合強度測定に及ぼす影響
岩田 知也, 布施 淳也, 蛯子 颯大, 永野 風矢, 井上 史大
エレクトロニクス実装学術講演大会講演論文集 37 ( 0 ) 15A2-4 2023.3
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：一般社団法人エレクトロニクス実装学会 Joint Work
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ウエハ接合強度測定におけるばらつき最小化の検討
布施 淳也, 岩田 知也, 蛯子 颯大, 井上 史大
エレクトロニクス実装学術講演大会講演論文集 37 ( 0 ) 15A2-3 2023.3
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：一般社団法人エレクトロニクス実装学会 Joint Work
Review Papers 【 display / non-display 】
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Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne … Show more authors
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne, E. and De. Gendt, S. Hide authors
ECS Journal of Solid State Science and Technology 9 ( 12 ) 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
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Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyn … Show more authors
Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyne, E. Hide authors
Journal of Manufacturing Processes 58 811 - 818 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
Awards 【 display / non-display 】
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令和６年度科学技術分野の文部科学大臣表彰【若手科学者賞】
2024.4 文部科学省
Individual or group name of awards：井上史大
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Best Student Award
2023.11 ICPT2023 Optimization of Pre-Bonding Surface for Cu/SiCNHybrid Bonding
Individual or group name of awards：Kohei Nakayama
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MES2022 ベストペーパー賞
2023.9 エレクトロニクス実装学会 ハイブリッド接合に向けた化学機械研磨中の金属腐食挙動の解析
Individual or group name of awards：岩田 知也、中山 航平、布施 淳也、蛯子 颯大、大西 洸輝、北川 颯人、井上 史大（横浜国立大学）
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横浜国立大学 令和4年度優秀研究者表彰 奨励賞
2023.3 横浜国立大学
Individual or group name of awards：井上史大
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公益財団法人里見奨学会 里見賞 研究提案表彰
2022.10 公益財団法人里見奨学会
Individual or group name of awards：井上史大
Preferred joint research theme 【 display / non-display 】
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3D integration
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Semiconductor manufacturing processes
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Hybrid bonding
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CMP
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Electrochemical deposition
Charge of on-campus class subject 【 display / non-display 】
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2024 Advanced Semiconductor Manufacturing
Interfaculty Graduate School of Innovative and Practical Studies
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2024 Micro and nanofabrication
Graduate school of Engineering Science
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2024 Manufacturing of Processing Systems B
Graduate school of Engineering Science
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2024 Manufacturing of Processing Systems A
Graduate school of Engineering Science
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2024 Design of Processing Systems B
Graduate school of Engineering Science