INOUE Fumihiro

Affiliation

Faculty of Engineering, Division of Systems Research

Job Title

Associate Professor

Research Fields, Keywords

Unit processes for 3D integration, advanced packaging

Web Site

https://inoue.ynu.ac.jp/en/

Related SDGs




ORCID  https://orcid.org/0000-0003-2292-846X

写真a

Degree 【 display / non-display

  • Doctor of Engineering - Kansai University

Campus Career 【 display / non-display

  • 2021.4
     
     

    Duty   Yokohama National UniversityFaculty of Engineering   Division of Systems Research   Associate Professor  

External Career 【 display / non-display

  • 2011.3
    -
    2014.10

    imec  

  • 2013.4
    -
    2014.10

    Tohoku University   Special researcher of the Japan Society for the Promotion of Science  

  • 2014.10
    -
    2021.3

    imec   Researcher  

 

Papers 【 display / non-display

  • Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding

    Park Kimoon, Inoue Fumihiro, Derakhshandeh Jaber, Yoo Bongyoung

    JAPANESE JOURNAL OF APPLIED PHYSICS   61 ( 4 )   041003-1 - 041003-9   2022.4  [Reviewed]

    DOI Web of Science

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    Language:English   Publishing type:Research paper (scientific journal)   Joint Work  

  • Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging

    Inoue Fumihiro, Phommahaxay Alain, Gokita Yohei, Moeller Berthold, Beyne Eric

    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY   119 ( 5-6 )   3427 - 3435   2022.3  [Reviewed]

    DOI Web of Science

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    Language:English   Publishing type:Research paper (scientific journal)   Joint Work  

  • Area-Selective Electroless Deposition of Cu for Hybrid Bonding

    Inoue Fumihiro, Iacovo Serena, El-Mekki Zaid, Kim Soon-Wook, Struyf Herbert, Beyne Eric

    IEEE ELECTRON DEVICE LETTERS   42 ( 12 )   1826 - 1829   2021.12  [Reviewed]

    DOI Web of Science

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    Language:English   Publishing type:Research paper (scientific journal)   Joint Work  

  • Area-Selective Electroless Deposition of Cu for Hybrid Bonding

    Inoue Fumihiro, Iacovo Serena, El-Mekki Zaid, Kim Soon-Wook, Struyf Herbert, Beyne Eric

    IEEE Electron Device Letters   42 ( 12 )   1826 - 1829   2021.11

    CiNii Research

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    Language:English   Publishing type:Research paper (scientific journal)   Publisher:IEEE   Joint Work  

    This letter describes the use of area-selective electroless Cu deposition for topography control of Cu-SiCN hybrid bonding pads. The electroless deposition of Cu allows one to obtain protrusions on hybrid bonding Cu pads without further polishing optimization. A recessed Cu pad after chemical mechanical polishing becomes a protrusion after electroless deposition. This indicates that the electroless Cu film was selectively deposited on Cu, without deposition on the SiCN surface. A void-free Cu-Cu bonding interface was observed after annealing at 350 °C with an electroless Cu layer at the interface. 100% electrical connection was obtained at 1.4- μm pitch where the deposition thickness was on target.

  • Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

    Iacovo Serena, Peng Lan, Nagano Fuya, Uhrmann Thomas, Burggraf Jurgen, Fehkuhrer Andreas, Conard Th … Show more authors

    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)   2097 - 2104   2021.6  [Reviewed]

    DOI Web of Science

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    Language:English   Publishing type:Research paper (scientific journal)   Joint Work  

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Review Papers 【 display / non-display

Awards 【 display / non-display

  • 2021年度「貴金属に関わる研究助成金」 ゴールド賞

    2022.3   一般財団法人 田中貴金属記念財団   貴金属配線による裏面電源供給ネットワークの形成

    Individual or group name of awards:井上 史大

  • 第36回「研究費の助成」

    2022.3   東京応化科学技術振興財団   「形態制御めっき技術を用いた低温Cu-SiCNハイブリッド接合技術の開発」

    Individual or group name of awards:井上史大

  • Outstanding Technical Paper Award

    2021.5   国際会議 ICEP2021   Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

    Individual or group name of awards:Fumihiro Inoue, Jaber Derakhshandeh, Carine Gerets, Eric Beyne

  • ECTC2020 Outstanding Session Paper

    2020.5   IEEE   10 and 7 µm Pitch Thermo-Compression Solder Joint, Using a Novel Solder Pillar and Metal Spacer Process

    Individual or group name of awards:Jaber Derakhshandek, Giovanni Capuz, Vladimir Cherman, Fumihiro Inoue, Inge De Preter, Lin Hou, Pieter Bex, Carine Gerets, Fabrice Duval, Thomas Webers, Julien Bertheau, Stefaan Van Huylenbroeck, Alain Phommahaxay, Ehsan Shafahian, Geert Van der Plas, Eric Beyne, Andy Miller, Gerald Beyer - IMEC

Preferred joint research theme 【 display / non-display

  • 3D integration

  • Semiconductor manufacturing processes

  • Hybrid bonding

  • CMP

  • Electrochemical deposition

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Charge of on-campus class subject 【 display / non-display

  • 2022   Precision engineering

    Graduate school of Engineering Science

  • 2022   Machine Design 2

    College of Engineering Science

  • 2022   Machine Design 1

    College of Engineering Science

  • 2022   Design of Processing Systems B

    Graduate school of Engineering Science

  • 2022   Design of Processing Systems A

    Graduate school of Engineering Science

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