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Affiliation |
Faculty of Engineering, Division of Systems Research |
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Job Title |
Associate Professor |
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Research Fields, Keywords |
Unit processes for 3D integration, advanced packaging |
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Web Site |
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Related SDGs |
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INOUE Fumihiro
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ORCID
Degree 【 display / non-display 】
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Doctor of Engineering - Kansai University
Campus Career 【 display / non-display 】
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2021.4
Duty Yokohama National UniversityFaculty of Engineering Division of Systems Research Associate Professor
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2022.10
Concurrently Yokohama National UniversityInstitute of Advanced Sciences Associate Professor
External Career 【 display / non-display 】
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2011.3-2014.10
imec
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2013.4-2014.10
Tohoku University Special researcher of the Japan Society for the Promotion of Science
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2014.10-2021.3
imec Researcher
Papers 【 display / non-display 】
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Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance
Nagano F., Inoue F., Phommahaxay A., Peng L., Chancerel F., Naser H., Beyer G., Uedono A., Beyne E. … Show more authors
Nagano F., Inoue F., Phommahaxay A., Peng L., Chancerel F., Naser H., Beyer G., Uedono A., Beyne E., De Gendt S., Iacovo S. Hide authors
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 12 ( 3 ) 2023.3 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Wafer Thinning for 3D Integration
Inoue Fumihiro
Journal of The Japan Institute of Electronics Packaging 26 ( 1 ) 172 - 177 2023.1
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：The Japan Institute of Electronics Packaging Single Work
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三次元実装基礎講座(第2回)ウエハ薄化技術
井上 史大
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 26 ( 1 ) 172 - 177 2023.1
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：エレクトロニクス実装学会 Single Work
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Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
Nagano F., Iacovo S., Phommahaxay A., Inoue F., Chancerel F., Naser H., Beyer G., Beyne E., De Gend … Show more authors
Nagano F., Iacovo S., Phommahaxay A., Inoue F., Chancerel F., Naser H., Beyer G., Beyne E., De Gendt S. Hide authors
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 11 ( 6 ) 2022.6 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Park Kimoon, Inoue Fumihiro, Derakhshandeh Jaber, Yoo Bongyoung
JAPANESE JOURNAL OF APPLIED PHYSICS 61 ( 4 ) 041003-1 - 041003-9 2022.4 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
Review Papers 【 display / non-display 】
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Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyn … Show more authors
Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyne, E. Hide authors
Journal of Manufacturing Processes 58 811 - 818 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
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Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne … Show more authors
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne, E. and De. Gendt, S. Hide authors
ECS Journal of Solid State Science and Technology 9 ( 12 ) 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
Awards 【 display / non-display 】
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横浜国立大学 令和4年度優秀研究者表彰 奨励賞
2023.3 横浜国立大学
Individual or group name of awards：井上史大
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公益財団法人里見奨学会 里見賞 研究提案表彰
2022.10 公益財団法人里見奨学会
Individual or group name of awards：井上史大
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IEEE EPS Outstanding Young Engineer Award
2022.6 IEEE Electronics Packaging Society
Individual or group name of awards：Fumihiro Inoue
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2022.3 一般財団法人 田中貴金属記念財団 貴金属配線による裏面電源供給ネットワークの形成
Individual or group name of awards：井上 史大
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第36回「研究費の助成」
2022.3 東京応化科学技術振興財団 「形態制御めっき技術を用いた低温Cu-SiCNハイブリッド接合技術の開発」
Individual or group name of awards：井上史大
Preferred joint research theme 【 display / non-display 】
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3D integration
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Semiconductor manufacturing processes
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Hybrid bonding
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CMP
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Electrochemical deposition
Charge of on-campus class subject 【 display / non-display 】
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2023 Machine Design 2
College of Engineering Science
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2023 Machine Design 1
College of Engineering Science
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2023 Manufacturing of Processing Systems B
Graduate school of Engineering Science
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2023 Manufacturing of Processing Systems A
Graduate school of Engineering Science
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2023 Design of Processing Systems B
Graduate school of Engineering Science