INOUE Fumihiro

Affiliation

Faculty of Engineering, Division of Systems Research

Job Title

Associate Professor

Research Fields, Keywords

Unit processes for 3D integration, advanced packaging

Web Site

https://inoue.ynu.ac.jp/en/

Related SDGs




ORCID  https://orcid.org/0000-0003-2292-846X

写真a

Degree 【 display / non-display

  • Doctor of Engineering - Kansai University

Campus Career 【 display / non-display

  • 2021.4
     
     

    Duty   Yokohama National UniversityFaculty of Engineering   Division of Systems Research   Associate Professor  

External Career 【 display / non-display

  • 2011.3
    -
    2014.10

    imec  

  • 2013.4
    -
    2014.10

    Tohoku University   Special researcher of the Japan Society for the Promotion of Science  

  • 2014.10
    -
    2021.3

    imec   Researcher  

 

Papers 【 display / non-display

  • Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration

    Inoue Fumihiro, Derakhshandeh Jaber, Lofrano Melina, Beyne Eric

    JAPANESE JOURNAL OF APPLIED PHYSICS   60 ( 2 )   026502-1 - 026502-6   2021.2  [Reviewed]

    DOI Web of Science

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    Language:English   Publishing type:Research paper (scientific journal)   Joint Work  

  • Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

    Iacovo Serena, Peng Lan, Nagano Fuya, Uhrmann Thomas, Burggraf Jurgen, Fehkuhrer Andreas, Conard Th … Show more authors

    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)   2097 - 2104   2021  [Reviewed]

    DOI Web of Science

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    Language:English   Publishing type:Research paper (scientific journal)   Joint Work  

  • A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps

    Derakhshandeh Jaber, Gerets Carine, Inoue Fumihiro, Capuz Giovanni, Cherman Vladimir, Lofrano Melin … Show more authors

    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)   1119 - 1124   2021  [Reviewed]

    DOI Web of Science

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    Language:English   Publishing type:Research paper (scientific journal)   Joint Work  

  • Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications

    F. Nagano, S. Iacovo, A. Phommahaxay, F. Inoue, E. Sleeckx, G. Beyer, E. Beyne, S. De. Gendt

    ECS Journal of Solid State Science and Technology   9 ( 12 )   123011-1 - 123011-7   2020.12  [Reviewed]

    DOI

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    Language:English   Publishing type:Research paper (scientific journal)   Joint Work  

  • Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

    Fumihiro Inoue, Arnita Podpod, Lan Peng, Alain Phommahaxay, Kenneth June Rebibis, Akira Uedono, Eri … Show more authors

    Journal of Manufacturing Processes   58   811 - 818   2020.10  [Reviewed]

    DOI

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    Language:English   Publishing type:Research paper (scientific journal)   Publisher:Elsevier   Joint Work  

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Review Papers 【 display / non-display

Awards 【 display / non-display

  • Outstanding Technical Paper Award

    2021.5   国際会議 ICEP2021   Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

    Individual or group name of awards: Fumihiro Inoue, Jaber Derakhshandeh, Carine Gerets, Eric Beyne

  • ECTC2020 Outstanding Session Paper

    2020.5   IEEE   10 and 7 µm Pitch Thermo-Compression Solder Joint, Using a Novel Solder Pillar and Metal Spacer Process

    Individual or group name of awards: Jaber Derakhshandek, Giovanni Capuz, Vladimir Cherman, Fumihiro Inoue, Inge De Preter, Lin Hou, Pieter Bex, Carine Gerets, Fabrice Duval, Thomas Webers, Julien Bertheau, Stefaan Van Huylenbroeck, Alain Phommahaxay, Ehsan Shafahian, Geert Van der Plas, Eric Beyne, Andy Miller, Gerald Beyer - IMEC

Preferred joint research theme 【 display / non-display

  • 3D integration

  • Semiconductor manufacturing processes

  • Hybrid bonding

  • CMP

  • Electrochemical deposition

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