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Affiliation |
Faculty of Engineering, Division of Systems Research |
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Job Title |
Associate Professor |
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Research Fields, Keywords |
Unit processes for 3D integration, advanced packaging |
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Web Site |
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Related SDGs |
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INOUE Fumihiro
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ORCID
Degree 【 display / non-display 】
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Doctor of Engineering - Kansai University
Campus Career 【 display / non-display 】
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2021.4
Duty Yokohama National UniversityFaculty of Engineering Division of Systems Research Associate Professor
External Career 【 display / non-display 】
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2011.3-2014.10
imec
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2013.4-2014.10
Tohoku University Special researcher of the Japan Society for the Promotion of Science
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2014.10-2021.3
imec Researcher
Papers 【 display / non-display 】
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Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
Inoue Fumihiro, Derakhshandeh Jaber, Lofrano Melina, Beyne Eric
JAPANESE JOURNAL OF APPLIED PHYSICS 60 ( 2 ) 026502-1 - 026502-6 2021.2 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Iacovo Serena, Peng Lan, Nagano Fuya, Uhrmann Thomas, Burggraf Jurgen, Fehkuhrer Andreas, Conard Th … Show more authors
Iacovo Serena, Peng Lan, Nagano Fuya, Uhrmann Thomas, Burggraf Jurgen, Fehkuhrer Andreas, Conard Thierry, Inoue Fumihiro, Kim Soon-Wook, De Vos Joeri, Phommahaxay Alain, Beyne Eric Hide authors
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) 2097 - 2104 2021 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh Jaber, Gerets Carine, Inoue Fumihiro, Capuz Giovanni, Cherman Vladimir, Lofrano Melin … Show more authors
Derakhshandeh Jaber, Gerets Carine, Inoue Fumihiro, Capuz Giovanni, Cherman Vladimir, Lofrano Melina, Hou Lin, Cochet Tom, De Preter Inge, Webers Tomas, Bex Pieter, Jamieson Geraldine, Maehara Masataka, Shafahian Ehsan, Bertheau Julien, Beyne Eric, La Tulipe Douglas Charles, Beyer Gerald, Van der Plas Geert, Miller Andy Hide authors
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) 1119 - 1124 2021 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
F. Nagano, S. Iacovo, A. Phommahaxay, F. Inoue, E. Sleeckx, G. Beyer, E. Beyne, S. De. Gendt
ECS Journal of Solid State Science and Technology 9 ( 12 ) 123011-1 - 123011-7 2020.12 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
Fumihiro Inoue, Arnita Podpod, Lan Peng, Alain Phommahaxay, Kenneth June Rebibis, Akira Uedono, Eri … Show more authors
Fumihiro Inoue, Arnita Podpod, Lan Peng, Alain Phommahaxay, Kenneth June Rebibis, Akira Uedono, Eric Beyne Hide authors
Journal of Manufacturing Processes 58 811 - 818 2020.10 [Reviewed]
Language：English Publishing type：Research paper (scientific journal) Publisher：Elsevier Joint Work
Review Papers 【 display / non-display 】
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Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyn … Show more authors
Inoue, F. and Podpod, A. and Peng, L. and Phommahaxay, A. and Rebibis, K.J. and Uedono, A. and Beyne, E. Hide authors
Journal of Manufacturing Processes 58 811 - 818 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
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Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne … Show more authors
Nagano, F. and Iacovo, S. and Phommahaxay, A. and Inoue, F. and Sleeckx, E. and Beyer, G. and Beyne, E. and De. Gendt, S. Hide authors
ECS Journal of Solid State Science and Technology 9 ( 12 ) 2020 [Reviewed] [Invited]
Language：Japanese Publishing type：Article, review, commentary, editorial, etc. (bulletin of university, research institution) Joint Work
Awards 【 display / non-display 】
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Outstanding Technical Paper Award
2021.5 国際会議 ICEP2021 Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
Individual or group name of awards： Fumihiro Inoue, Jaber Derakhshandeh, Carine Gerets, Eric Beyne
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ECTC2020 Outstanding Session Paper
2020.5 IEEE 10 and 7 µm Pitch Thermo-Compression Solder Joint, Using a Novel Solder Pillar and Metal Spacer Process
Individual or group name of awards： Jaber Derakhshandek, Giovanni Capuz, Vladimir Cherman, Fuｍihiro Inoue, Inge De Preter, Lin Hou, Pieter Bex, Carine Gerets, Fabrice Duval, Thomas Webers, Julien Bertheau, Stefaan Van Huylenbroeck, Alain Phommahaxay, Ehsan Shafahian, Geert Van der Plas, Eric Beyne, Andy Miller, Gerald Beyer - IMEC
Preferred joint research theme 【 display / non-display 】
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3D integration
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Semiconductor manufacturing processes
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Hybrid bonding
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CMP
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Electrochemical deposition