SANO Marie

Affiliation

Institute for Multidisciplinary Sciences

Job Title

Assistant Professor

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Degree 【 display / non-display 】

  • Doctor of Engineering - Chiba University

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Campus Career 【 display / non-display 】

  • 2024.6
    　
    　

    Duty   Yokohama National UniversityInstitute for Multidisciplinary Sciences   Assistant Professor  

  • 2023.7
    -
    2024.5

    Duty   Yokohama National UniversityFaculty of Engineering   Division of Systems Research   Assistant Professor  

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Papers 【 display / non-display 】

  • SiCN膜の膜質がハイブリッドボンディングに及ぼす影響

    中田涼平, 石谷伸治, 持田篤範, 櫻井大輔, 佐野麻理恵, 井上史大

    第40回エレクトロニクス実装学会春季講演大会論文集   2026.3

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    Language：Japanese   Publishing type：Research paper (scientific journal)   Single Work  

  • Statistical Evaluation of Bond Strength Variation in Hybrid Bonding Interfaces

    Daiki Kobayashi, Shunsuke Teranishi, Yuki Yoshihara, Marie Sano, Fumihiro Inoue

    2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)   2026.2  [Reviewed]

    DOI

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    Language：English   Publishing type：Research paper (international conference proceedings)   Joint Work  

  • Measurement Methods of Within-Wafer Bond Strength Uniformity for Hybrid Bonding

    KOBAYASHI Daiki, FUSE Junya, KONDO Yusuke, YOSHIHARA Yuki, SANO Marie, INOUE Fumihiro

    Journal of Smart Processing   15 ( 1 )   31 - 35   2026.1

    DOI CiNii Research

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    Language：Japanese   Publishing type：Research paper (scientific journal)   Publisher：Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)   Joint Work  

  • Void-Free, Low-temperature Direct Bonding of Si–Si for μLHP Integration in 3D ICs

    Dianping Jiang, Marie Sano, Fumihiro Inoue, Masaaki Hashimoto, Hosei Nagano, Munehiro Tada

    2025 International Conference on Solid State Devices and Materials   2025.9  [Reviewed]

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    Language：English   Publishing type：Research paper (international conference proceedings)   Single Work  

  • Within-Wafer and Within-Die Uniformity of Bond Strength for Hybrid Bonding

    Daiki Kobayashi, Junya Fuse, Yusuke Kondo, Yuki Yoshihara, Marie Sano, Fumihiro Inoue

    2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)   2025.5  [Reviewed]

    DOI

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    Language：English   Publishing type：Research paper (international conference proceedings)   Single Work  

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Presentations 【 display / non-display 】

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