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Affiliation |
Institute for Multidisciplinary Sciences |
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Job Title |
Assistant Professor |
SANO Marie
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Degree 【 display / non-display 】
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Doctor of Engineering - Chiba University
Campus Career 【 display / non-display 】
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2024.6
Duty Yokohama National UniversityInstitute for Multidisciplinary Sciences Assistant Professor
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2023.7-2024.5
Duty Yokohama National UniversityFaculty of Engineering Division of Systems Research Assistant Professor
Papers 【 display / non-display 】
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Water stress corrosion at wafer bonding interface during bond strength evaluation
Iwata, T; Fuse, J; Yoshihara, Y; Kondo, Y; Sano, M; Inoue, F
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 184 2024.12
Language：English Publishing type：Research paper (scientific journal) Joint Work
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Use of digital image correlation method to evaluate the properties of mold compound targeted for fan out wafer level packaging applications
Proceedings of JIEP Annual Meeting 38 ( 0 ) 15B1-1 2024
Language：Japanese Publishing type：Research paper (scientific journal) Publisher：The Japan Institute of Electronics Packaging Joint Work
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Critical Parameters of Bond Strength Measurement on Wafer Bonding
Kondo, Y; Fuse, J; Yoshihara, Y; Sano, M; Nakamura, Y; Matsubara, I; Inoue, F
2024 IEEE 10TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC 2024 2024
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Bond Strength Measurement for Wafer-Level and Chip-Level Hybrid Bonding
Fuse, J; Yoshihara, Y; Sano, M; Inoue, F
2024 IEEE 10TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC 2024 2024
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
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Exploring Bond Strength for Advanced Chiplet with Hybrid Bonding
Fuse, J; Iwata, T; Yoshihara, Y; Sano, M; Inoue, F
PROCEEDINGS OF THE 25TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, EPTC 2023 199 - 203 2023
Language：English Publishing type：Research paper (international conference proceedings) Joint Work
Presentations 【 display / non-display 】
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Impact of Long-term Stress and Measurement Environment on Bonding Strength
Proceedings of Microelectronics Symposium 2023.9 The Japan Institute of Electronics Packaging
Event date： 2023
Language：Japanese Presentation type：Oral presentation (general)