Institute of advanced Science


Associate Professor

Research Fields, Keywords

Strength of Materials, Fracture Mechanics, Interfacial Strength, Thin Films, Electronics Packaging, Reliability, Fatigue, Creep, Thermal Fatigue, Delamination

Mail Address

E-mail address

Homepage URL

Graduating School 【 display / non-display


    Kyoto University   Faculty of Engineering   Department of Engineering of Physics   Graduated

Graduate School 【 display / non-display


    Kyoto University  Graduate School, Division of Engineering  Department of Engineering Physics and Mechanics  Doctor Course  Completed

Degree 【 display / non-display

  • Ph.D -  Kyoto University

External Career 【 display / non-display

  • 2012.08

    Senior Scientific Research Specialist, MEXT  

  • 2007.03

    University of Maryland   Visiting scholar  

Academic Society Affiliations 【 display / non-display

  • 1998

    Japan Society of Mechanical Engineering


    Japan Society of Material Science


    Japan Institute of Electronics Packaging




    Japan Society for Safety Engineering

Field of expertise (Grants-in-aid for Scientific Research classification) 【 display / non-display

  • Social systems engineering/Safety system

  • Materials/Mechanics of materials


Research Career 【 display / non-display

  • Reliability of Micro Joints in Electronics Packaging

    Grant-in-Aid for Scientific Research  

    Project Year:  -   

  • Mechanism of Fracture due to Atom Migration in Small Structures

    Project Year:  -   

  • Evaluation of Interfacial Strength between Thin Films

    Grant-in-Aid for Scientific Research  

    Project Year:  -   

Books 【 display / non-display

  • Mitigating Tin Whisker Risks: Chapter 9 Mechanically induced tin whiskers

    Tadahiro Shibutani, Michael Osterman (Part: Contributor , Range: Chapter 9 Mechanically induced tin whiskers )

    Wiley  2016.06

     View Summary

    This chapter discusses the pressure-induced whisker at separable interfaces as a key reliability issue of lead-free separable contacts and connectors. It shows theories of mechanically induced tin whiskers. Then, several case studies with pure tin and lead-free finishes were performed to evaluate pressure-induced tin whiskers. For electronics components, several factors affect the stress field of the finish: (i) thickness of the plating, (ii) structure of the ambient component material, and (iii) material microstructures. As a methodology for the assessment of pressure-induced tin whisker formation, the creep-based tin whisker formation model shows good results. Several connectors with tin or tin-rich alloy finishes were assessed by means of the nanoindentation technique. For the flexible printed circuit (FPC), mechanical properties of adhesives are key factors influencing tin whisker formation. Each mechanical property can be obtained by the indentation technique, and stress distribution can be estimated by finite element analysis (FEA).

  • High reliability lead-free plating and tin whisker mitigation

    JIEP Tin Whisker Research Comittee (Part: Joint Editor )

    THE NIKKAN KOGYO SHIMBUN,LTD.  2013.12 ISBN: 978-4-526-071

Papers 【 display / non-display

  • IoT-Based Prognostics and Systems Health Management for Industrial Applications

    Daeil Kwon, Melinda R. Hodkiewicz, Jiajie Fan, Tadahiro Shibutani, Michael G. Pecht

    IEEE Access ( IEEE )  4   3659 - 3670   2016.07  [Refereed]

    Joint Work

    Web of Science DOI

  • Verification of appropriate life parameters in risk and reliability quantifications of process hazards

    Mahesh Kodoth, Tadahiro Shibutani, Yehia F Khalil, Atsumi Miyake

    Process Safety and Environmental Protection ( Elsevier )  127   314 - 320   2019.07  [Refereed]

    Single Work

     View Summary

    Failure frequency estimation is one of the important measures of risk quantification. In traditional reliability assessment, mean time to failure (MTTF) is one of the most common life parameter to field failure data analysis. However, it is critically important to use correct life parameter for accurate reliability estimation. One of the uncertainties in reliability assessment is the inappropriate life parameter and how they could be selected. The scope of this study is to select an appropriate life parameters for hydrogen refueling stations (HRS). Field failure data of HRS is used as a case study to compare failure analysis based on two life parameters i.e. survival time vs. number of fillings at the station. A non-parametric estimator is used to estimate cumulative failure function based on number of fillings. The cumulative hazard using the Nelson-Aalen estimator showed a linear relationship with the number of fillings. A parametric estimator using 2-values (β and η) Weibull distribution function is employed to estimate cumulative probability of failure with the survival time. The present study demonstrates that the failure rate can vary by a small to large margin based on the life parameter and estimator chosen for reliability predictions. This shows the importance and need of verification of life parameter in QRA to reduce uncertainty associated with the risk calculation.


  • Evaluating uncertainty in accident rate estimation at hydrogen refueling station using time correlation model

    Mahesh Kodoth,Shu Aoyama,Junji Sakamoto,Naoya Kasai,Tadahiro Shibutani,Atsumi Miyake

    International Journal of Hydrogen Energy ( Elsevier )  43 ( 52 )   23409 - 23417   2018.11  [Refereed]

    Joint Work

     View Summary

    Hydrogen, as a future energy carrier, is receiving a significant amount of attention in Japan. From the viewpoint of safety, risk evaluation is required in order to increase the number of hydrogen refueling stations (HRSs) implemented in Japan. Collecting data about accidents in the past will provide a hint to understand the trend in the possibility of accidents occurrence by identifying its operation time However, in new technology; accident rate estimation can have a high degree of uncertainty due to absence of major accident direct data in the late operational period. The uncertainty in the estimation is proportional to the data unavailability, which increases over long operation period due to decrease in number of stations. In this paper, a suitable time correlation model is adopted in the estimation to reflect lack (due to the limited operation period of HRS) or abundance of accident data, which is not well supported by conventional approaches. The model adopted in this paper shows that the uncertainty in the estimation increases when the operation time is long owing to the decreasing data.


  • Potential failure mode identification of operational amplifier circuit board by using high accelerated limit test

    Junji Sakamoto, Ryoma Hirata, Tadahiro Shibutani

    Microelectronics Reliability ( Elsevier )  85   19 - 24   2018.06  [Refereed]

    Joint Work

     View Summary



  • Security risk analysis of a hydrogen fueling station with an on-site hydrogen production system involving methylcyclohexane

    Jo Nakayama,Naoya Kasai,Tadahiro Shibutani,Atsumi Miyake

    International Journal of Hydrogen Energy ( Elsevier )    2018.04  [Refereed]

    Joint Work

     View Summary

    Although many studies have looked at safety issues relating to hydrogen fueling stations, few studies have analyzed the security risks, such as deliberate attack of the station by threats such as terrorists and disgruntled employees. The purpose of this study is to analyze security risks for a hydrogen fueling station with an on-site production of hydrogen from methylcyclohexane. We qualitatively conducted a security risk analysis using American Petroleum Institute Standard 780 as a reference for the analysis. The analysis identified 93 scenarios, including pool fires. We quantitatively simulated a pool fire scenario unique to the station to analyze attack consequences. Based on the analysis and the simulation, we recommend countermeasures to prevent and mitigate deliberate attacks.


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Review Papers 【 display / non-display

  • A fusion prognostics-based qualification test methodology for microelectronic products

    Michael Pecht, Tadahiro Shibutani, Myeongsu Kang, Melinda Hodkiewicz, Edward Cripps

    Microelectronics Reliability ( Elsevier )  63   320 - 324   2016.07  [Refereed]  [Invited]

    Introduction and explanation (scientific journal)   Joint Work

  • Standards for Tin Whisker Test Methods on Lead-Free Components

    Shibutani Tadahiro, Michael Osterman, Michael Pecht

    IEEE Transactions on Components and Packaging Technologies   32 ( 1 ) 216 - 219   2009.03

    Introduction and explanation (others)   Joint Work

  • Tin Copper Alloy Double-layered Plating Mitigating Tin Whiskers

    Function & Materials   28 ( 9 ) 20 - 25   2008.09

    Introduction and explanation (others)   Joint Work

  • Mechanism of pressure induced tin whisker formation

      28 ( 8 ) 30 - 35   2008.08

    Introduction and explanation (others)   Single Work

  • Evaluation of Interfacial Damage Process between Multi-layered Thin Films Using a Nanoscratch Test

      9 ( 6 ) 455 - 458   2006.09

    Introduction and explanation (scientific journal)   Single Work

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Academic Awards Received 【 display / non-display

  • Best Paper Award in Microelectronics Symposium 2006


  • JSME Funai Award


  • JSME Young Engineers Award