YU Qiang

Organization

Faculty of Engineering, Division of Systems Research

Title

Professor

Date of Birth

1964

Research Fields, Keywords

Reliability Estimation, Solder Joints, Fatigue Life, Thermal Fatigue, Impact Strength, Micro Joints, Drop Test, Dynamic Analysis, Optimization Design, Nonlinear, System Design, Complex System of Fracture, Reliability, Fracture Control, Design of Cras



Graduate School 【 display / non-display

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    -
    1992

    Yokohama National University  Graduate School, Division of Engineering  material science and mechanical engineering    Completed

Degree 【 display / non-display

  • Doctor of Engineering -  Yokohama National University

Academic Society Affiliations 【 display / non-display

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    JSME(The Japan Society of Mechanical Engineers)

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    JSAE(Society of Automotive Engineers of Japan)

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    JIEP(Japan Institute of Electronics Packaging)

Field of expertise (Grants-in-aid for Scientific Research classification) 【 display / non-display

  • Materials/Mechanics of materials

 

Papers 【 display / non-display

  • Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

    Anzawa, T., Yu, Q., Yamagiwa, M., Shibutani, T., Shiratori, M.

    J. Electron. Package   132 ( 3 )   1 - 6   2010  [Refereed]

    Joint Work

    Web of Science

  • Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints

    Tadahiro Shibutani, Do-Seop Kim, Yusuke Kobayashi, Jidong Yang, Masaki Shiratori

    Elsevier Journal   48   431 - 437   2008.03  [Refereed]

    Joint Work

    Web of Science

  • Strength Analysis of Resin Delamination of Packaging Structure of Power Module

    2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)     2018  [Refereed]

    DOI

  • Reliability Evaluation of BGA Solder Joints in Vision Processor by Passive Cooling

    2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)     2018  [Refereed]

    DOI

  • Thermal Performance Evaluation and Reliability Analysis of Air-cooled Power Modules

    2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)     2018  [Refereed]

    DOI

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Review Papers 【 display / non-display

  • High-density Through-hole Interconnections in a Silicon Substrate

    Shibutani,T.,Nakamura,H.,Wada,H.,Itoi,K.,Yamamoto,S.,Suemasu,T. and Takizawa,T.

    Fujikura Technical Review   33   53 - 56   2004.01

    Introduction and explanation (scientific journal)   Joint Work

Industrial Property 【 display / non-display

  • The jig for environmental test of the material testing machine

    Industrial Property No 平成11年特許願第291227号  Patent No 特許第3500338

    Shiratori,M., Yu,Q.,Okumoto,Y.,Irisa,T.

     View Summary

    Development of the material testing for the microstructure

Academic Awards Received 【 display / non-display

  • The recommendation report prize(33th reliability・maintainability symposium) 2003

    2003.10    

  • Paper prize of JSME

    1999    

Preferred joint research theme 【 display / non-display

  • Research on Manufacturing and Structural Reliability Dedign

  • Research on Manufacturing and Structural Reliability Dedign